Most of us in the medical device industry are familiar with process capability measurement terms Cp, Cpk, Pp, and Ppk. A small subset of us uses these metrics to generate process validation reports claiming to meet our customers’ capability requirements. But how many OEMs and suppliers have gone to the next level by providing the empirical evidence necessary to prove that the measured data...
This multilayer board shows a design using critical through-hole and SMD technology. Many of these boards cannot withstand typical solder processing temperatures.
Modern medical monitoring devices require extremely complex internal electronic assemblies. The availability of highly miniaturized, low-power RF devices and specialized...
Originally Published MEM Fall 2009
Sonoscan acoustic images showing delaminations (red) on lead fingers, and type of damage consistent with improper alloy conversion methods.
The introduction of the RoHS (Restriction of Hazardous Substances) Directive by the European Union (EU) on July 1, 2006, had a significant effect on electronics. It...
Originally Published MEM Spring 2002
Microelectronics manufacturing worldwide is in a state of transition: from lead-based solder to lead-free solder.
Over the next several years, microelectronics manufacturing will shift from the use of familiar lead-based solders to the use of lead-free solders. Although driven by legislation in Europe, the...
A Medical Electronics Manufacturing Fall 1996 Feature
John M. Radman
Soldering requires careful planning—the amount and distribution of solder and the temperatures used for assembly can help determine the shelf life of an electronic device.
With the popularization of surface-mount technology in electronics, typical circuit boards are now much thinner and more densely...