Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, offers a top-load burn-in socket that saves time and money over conventional top-load sockets for new IC pin-out designs.
Based on a modular design, the new socket can be configured to accommodate devices on 0.3 mm pitch and higher and can be employed virtually any SMT device including BGA, µBGA, QFN, LGA, and bare dies as well as a number of other devices like those used for MEMS testing with high acceleration rates.
The compression spring probes leave minimal witness marks on the bottom surface of the device pads for increased reliability. Compression spring probes are constructed of heat-treated beryllium-copper, and plated with a minimum of 30 micro inches (0.75 micro mm) gold per MIL-G-45204 over a minimum of 30 micro inches (0.75 micro mm) nickel per SAE-AMS-QQ-N-290.
Contact forces are 15 g per contact on a 0.30 mm to <0.40 mm pitch; 16 g per contact on a 0.40 mm to <0.50 mm pitch and 25 g per contact on pitches of 0.50 mm or larger. Estimated contact life is a minimum of 500,000 cycles and operating temperature is -55°C to +150°C (-67°F to +302°F).
Pricing for a top load burn-in socket starts at $125. Delivery is 20 working days.