A designer and manufacturer of critical components has become fully HDI (high-density interconnect) capable for flexible circuits. It can provide HDI flexible circuits with blind and buried microvia capability down to 75 µm and trace and space capabilities down to 50 µm. The company says that HDI flex circuits lower cost by reducing layer count and circuit size, and that increased circuit density can eliminate extra layers and save up to 40% of the size and weight of non-HDI designs.

"HDI circuits have been used more frequently in many medical applications," according to Minco's Chris Eisenberg. "They are best suited for devices that need to be very small such as hearing aids and electronic medical implants. A common theme for all medical electronics has been the same as for cell phones—more functionality in smaller packages, which drives the need to have smaller components and smaller features."
 
Eisenberg says that an HDI interconnect can be used in a hearing aid and can be folded to accommodate installation into the plastic hearing aid. "As hearing aids become more sophisticated with wireless and digital technology, the demand for the number of inputs and electrical traces increases," he says. Minco, Minneapolis, MN, 763/571-3121.